CVE-2024-43047 - Qualcomm Multiple Chipsets Use-After-Free Vulnerability
项目：Qualcomm
产品：Multiple Chipsets
添加日期：2024-10-08到期日：2024-10-29最后更新：June 21, 2025
漏洞名称
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
描述
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.
已知用于勒索软件活动吗？
Unknown
采集行动
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
其他说明
https://git.codelinaro.org/clo/la/platform/vendor/qcom/opensource/dsp-kernel/-/commit/0e27b6c7d2bd8d0453e4465ac2ca49a8f8c440e2
https://nvd.nist.gov/vuln/detail/CVE-2024-43047
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