CVE-2023-33107—Qualcomm Multiple Chipsets Integer Overflow Vulnerability

PUBLISHEDvulnerability record
2023-12-05 · last modified June 21, 2025

Metadata

CVE ID：
CVE-2023-33107
项目：
Qualcomm
产品：
Multiple Chipsets
添加日期：
2023-12-05
到期日：
2023-12-26
最后更新：
June 21, 2025

漏洞名称

Qualcomm Multiple Chipsets Integer Overflow Vulnerability

描述

Multiple Qualcomm chipsets contain an integer overflow vulnerability due to memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.

已知用于勒索软件活动吗？

勒索软件状态：
Unknown

采集行动

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

其他说明

  • This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-4.19/-/commit/d66b799c804083ea5226cfffac6d6c4e7ad4968b
  • https://nvd.nist.gov/vuln/detail/CVE-2023-33107

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