CVE-2023-33063 - Qualcomm Multiple Chipsets Use-After-Free Vulnerability

漏洞名称

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

描述

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

已知用于勒索软件活动吗？

Unknown

采集行动

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

其他说明

This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110

https://nvd.nist.gov/vuln/detail/CVE-2023-33063

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