CVE-2023-33063—Qualcomm Multiple Chipsets Use-After-Free Vulnerability

漏洞名称

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

描述

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

已知用于勒索软件活动吗？

勒索软件状态：

Unknown

采集行动

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

其他说明

• This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110
• https://nvd.nist.gov/vuln/detail/CVE-2023-33063

相关新闻文章

• Qualcomm Fixes 3 Zero-Days Used in Targeted Android Attacks via Adreno GPUJune 2, 2025

相关 CWE

• CWE-416