CVE-2022-22071—Qualcomm Multiple Chipsets Use-After-Free Vulnerability

漏洞名称

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

描述

Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.

已知用于勒索软件活动吗？

勒索软件状态：

Unknown

采集行动

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

其他说明

• This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/586840fde350d7b8563df9889c8ce397e2c20dda
• https://nvd.nist.gov/vuln/detail/CVE-2022-22071

相关 CWE

• CWE-416