CVE-2023-33063 - Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Vulnerability Name

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Known To Be Used in Ransomware Campaigns?

Unknown

Action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Additional Notes

This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110

https://nvd.nist.gov/vuln/detail/CVE-2023-33063