CVE-2023-33063—Qualcomm Multiple Chipsets Use-After-Free Vulnerability

PUBLISHEDvulnerability record
2023-12-05 · last modified June 21, 2025

Metadata

CVE ID:
CVE-2023-33063
Project:
Qualcomm
Product:
Multiple Chipsets
Date Added:
2023-12-05
Due Date:
2023-12-26
Last Updated:
June 21, 2025

Vulnerability Name

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Known To Be Used in Ransomware Campaigns?

Ransomware Status:
Unknown

Action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Additional Notes

  • This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110
  • https://nvd.nist.gov/vuln/detail/CVE-2023-33063

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